[Brand Power·Hyun Shuo Optoelectronics] Automation Equipment Helps Cost Optimization

July 27, 2022

At the same time of the rapid growth of the LED industry, it also ushered in a new round of improvement in staff production and management costs. For packaging equipment companies, how to reduce costs, enhance market competitiveness, and improve the quality of the industry, has become a common thinking. The industry believes that achieving lean production with automation, scale, and standardization will point the way for the future development of packaging equipment companies.

Established in 2010, Hyun Shuo Optoelectronics focuses on the R&D, manufacturing and sales of LED optoelectronic devices (splits, tape machines, intelligent assembly lines for LED lamps, etc.). The existing dust-free purification workshop has more than 13,000 square meters, and the monthly production capacity of the equipment exceeds 400. The equipment produced is exported to all parts of the country and overseas markets, with an annual output value of several hundred million yuan. Today's Hyun Shuo Optoelectronics has become a leading enterprise in LED automation and intelligent equipment in China.

Hyun Shuo Optoelectronics Sales Vice President Yang Dong

Yang Dong Hyun seok photoelectric VP of Sales Engineering LED in Shenzhen station speech circuit described, the SMD-LED introduced single head automatic placement machine XSTP2015 / 1-DT-1200, LED lighting and display products in the production process LED lamp beads are mounted on FPC or PCB substrates to manufacture various lighting products and displays.

“Traditional LED automatic placement machine uses tape feeding and moving the placement head to complete the placement process. This type of placement machine is large in size and expensive. It needs to be taped before the placement and the tape is added. The equipment has high production cost.” Yang Dong said that the device does not need to tape the LED chip before the patch, which simplifies the production process. In addition, it uses a fixed chip head to spread the PCB substrate, which saves a lot of money. Production costs increase production efficiency.